Outsource your volumetric ultrathin sectioning
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Ship us resin-embedded samples in the form you want
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Flat embedded

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Embedded in a block

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Pre-trimmed

Any ultrathin-sectionable resin

Epon, LRWhite, HM20, Durcupan, ...

Tell us what region of interest (ROI) you need in your sample
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With a drawing

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With a picture

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Pre-trimmed to your ROI

Choose your substrate
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Glass substrate
Microscopy slides
Integrated CLEM

Whole silicon wafers

12, 25, 50, 75, 100 or 150 mm

Rectangular silicon wafer chip up to 100 mm x 100 mm

ø

Glass substrate
Coatings: ITO, gelatin

Glass substrate for

integrated CLEM

Choose your section number and thickness

How many sections ?

10 ... 400 ... 2000?

Thickness

50 nm to 500 nm

You receive your collected sections
ready for your 3D imaging experiments
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A description of the sections on wafer for

your automated imaging workflows 

in your microscopes

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All your sections are ready to be imaged

with your Scanning Electron Microscope
 

using the MagC module of
 

the                           software 

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