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Outsource your volumetric ultrathin sectioning
Ship us resin-embedded samples in the form you want
Flat embedded
Embedded in a block
Pre-trimmed
Any ultrathin-sectionable resin
Epon, LRWhite, HM20, Durcupan, ...
Tell us what region of interest (ROI) you need in your sample
With a drawing
With a picture
Pre-trimmed to your ROI
Choose your substrate
Glass substrate
Microscopy slides
Integrated CLEM
Whole silicon wafers
12, 25, 50, 75, 100 or 150 mm
Rectangular silicon wafer chip up to 100 mm x 100 mm
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Glass substrate
Coatings: ITO, gelatin
Glass substrate for
integrated CLEM
Choose your section number and thickness
How many sections ?
10 ... 400 ... 2000?
Thickness
50 nm to 500 nm
You receive your collected sections
ready for your 3D imaging experiments
A description of the sections on wafer for
your automated imaging workflows
in your microscopes
All your sections are ready to be imaged
with your Scanning Electron Microscope
using the MagC module of
the software
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